TOFWERK is excited to participate in the AVS International Conference on Atomic Layer Deposition (ALD 2024) from August 4 – 7, 2024 in Helsinki, Finland.
ALD 2024 which features the 11th International Atomic Layer Etching Workshop (ALE 2024) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas and practices between scientists.
TOFWERK Activities at ALD
Presentations
AF-MoP: ALD Fundamentals Poster Session
Monday, August 5, 5:45 PM – 7:00 PM
Hall 3
Poster: ALD Process Characterization and Monitoring Using an Electron Impact Time-of-Flight Mass Spectrometer, Dr. Abdelhak Bensaoula, TOFWERKÂ Â
AF1-WeA-2: ALD Fundamentals
Wednesday, August 7, 1:45pm
Hall 3A
Reaction Pathway of Copper Atomic Layer Deposition via Time-of-Flight Mass Spectrometry, Camilla Minzoni, Swiss Federal Laboratories for Materials Science and Technology (Empa)
Highlighted Solutions
Rugged and flexible process monitoring and control.
The TOFWERK Semicon Process Analyzer  uses electron ionization time-of-flight mass spectrometry to simultaneously detect and analyze all precursors, byproducts, and trace species in real time. Equipped with powerful, high-speed software, this process solution is designed to handle challenging requirements and enable fast, non-intrusive detection of process deviations in semiconductor processes.
Contact our team:
sales@tofwerk.com
